TECBOND™ 214

Economical, fast setting, packaging adhesive.

  • Reference: TECBOND® 214

  • Open Time: Short

  • Chemistry: EVA

  • Heat Resistant To: 85 °C

  • Low Temp Flex: -10 °C

  • Viscosity: Medium

Substrate Score
CARDBOARD 9
POLYSTYRENE 6
EXPANDED POLYSTYRENE 6
SOFT WOOD 4
SAND MOLD 4
ABS 2
LDPE 2
HDPE 2
POLYCARBONATE 2
POLYPROPYLENE 2
RIGID PVC 2
FLEXIBLE PVC 2
GRP 2
ALUMINIUM 2
STAINLESS STEEL 2
HARD WOOD 2
GLASS 2
PU FOAM 2
UV VARNISH 2

What Can We Glue For You?

We have the expertise to help you get the best from your hot melt adhesives. On-site audits are carried out to help you optimise your process and help with adhesive management, spotting issues before they develop into problems.

We have unique tools to allow you to instantly and accurately check your application efficiency.