TECBOND™ 7784

High and low temperature resistant multi-purpose polyamide adhesive.

  • Reference: TECBOND® 7784

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 105 °C

  • Low Temp Flex: -60 °C

  • Viscosity: Medium

Substrate Score
ABS 8
FLEXIBLE PVC 7
HARD WOOD 7
POLYCARBONATE 6
POLYSTYRENE 6
RIGID PVC 6
GRP 6
ALUMINIUM 6
STAINLESS STEEL 6
SOFT WOOD 6
CARDBOARD 6
EXPANDED POLYSTYRENE 5
SAND MOLD 4
GLASS 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
UV VARNISH 2

What Can We Glue For You?

We have the expertise to help you get the best from your hot melt adhesives. On-site audits are carried out to help you optimise your process and help with adhesive management, spotting issues before they develop into problems.

We have unique tools to allow you to instantly and accurately check your application efficiency.

ABS

LDPE

HDPE

POLYCARBONATE

POLYPROPYLENE

POLYSTYRENE

RIGID PVC

FLEXIBLE PVC

GRP

ALUMINIUM

STAINLESS STEEL

EXPANDED POLYSTYRENE

SOFT WOOD

HARD WOOD

SAND MOLD

GLASS

CARDBOARD

PU FOAM

UV VARNISH