TECBOND™ 7785

High temperature and chemical resistant multi-purpose polyamide adhesive.

  • Reference: TECBOND® 7785

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 135 °C

  • Low Temp Flex: -10 °C

  • Viscosity: Medium

Substrate Score
FLEXIBLE PVC 8
HARD WOOD 7
SAND MOLD 7
POLYSTYRENE 6
SOFT WOOD 6
CARDBOARD 6
ABS 4
POLYCARBONATE 4
RIGID PVC 4
GRP 4
ALUMINIUM 4
STAINLESS STEEL 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
EXPANDED POLYSTYRENE 2
GLASS 2
UV VARNISH 2

What Can We Glue For You?

We have the expertise to help you get the best from your hot melt adhesives. On-site audits are carried out to help you optimise your process and help with adhesive management, spotting issues before they develop into problems.

We have unique tools to allow you to instantly and accurately check your application efficiency.