TECBOND™ 7786

  • Reference: TECBOND® 7786

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 135 °C

  • Low Temp Flex: -35 °C

  • Viscosity: Medium

Substrate Score
ABS 8
POLYCARBONATE 6
POLYSTYRENE 6
RIGID PVC 6
FLEXIBLE PVC 6
GRP 6
ALUMINIUM 6
STAINLESS STEEL 6
SOFT WOOD 6
HARD WOOD 6
CARDBOARD 6
SAND MOLD 4
GLASS 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
EXPANDED POLYSTYRENE 2
UV VARNISH 2

What Can We Glue For You?

We have the expertise to help you get the best from your hot melt adhesives. On-site audits are carried out to help you optimise your process and help with adhesive management, spotting issues before they develop into problems.

We have unique tools to allow you to instantly and accurately check your application efficiency.